Mi Series

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AI Enabled Sorting and Smart Binning machine for advanced packaging, such as WLCSP, FOWLP, Die(HPC), HBM, SIP, Module, EMI Devices, Sensor & Display.

Our solutions are used in Mobility & Wearables segment, such as smartphones, tablets and wearables that require high functionality and low power small form factor devices.

Solutions for both the HPC & Memory and Automotive & Renewable Energy segments are also available with Smart Binning process to effectively sort the devcies into their respective grades (bins), a key and integral part of the device manufacturing process.

The platforms could be coupled with special process, such as de-burring for EMI devices, integrated artificial intelligence ("AI") visual inspection and smart factory automation; to effect a lower cost of ownership and a higher process quality.

Ai Series

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Ai Series focus mainly on Laser Bonding and Precision Bonding Platform for the HPC & Memory Segment, which encompasses the AI architecture, Application Processor, CPU, GPU and HBM.

The Laser Bonding Solutions include a cost effective Laser Compression Bonder (LCB), a Flip Chip platform with Laser Bonding capability, to effect reliable and quality bonding on commonly narrow pitched and warpage sensitive high end 2.5D and FCBGA packages.

Laser Assisted Bonding (LAB) platform is made available to replace the conventional reflow oven, to realize good bonding performance on narrow pitched and warpage prone devices.

Our Precision Bonders focus on Solutions for Fan-out and 2.5D device on reconstruction and CoW process.

Si Series

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Both Die level and Package level test handler are available in Si Series.

Our Die Level Known Good Die (KGD) platform is well applied on both SiC and Silicon devices with proven die handling capabilities and precise Test Module architecture, operating at both room and hot temperature settings, serving the Automotive & Renewable Energy segment, on end products alike Electric Vehicle (EV), chargers and inverters.

We serve the Mobility & Wearables segment with Light Sensor Test Handlers, a single platform to cater for multi-faceted test conditions and vision inspection.

Vi Series

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Vi Series provide standalone Automatic Optical Inspection (AOI) Solutions for various segments, with state of the art vision technique, such as IR and 3D inspection. The inclusion of our very owned AI Solutions improve the inspection quality and effect a higher quality and a lower wastage process.

Vi series come in different format to serve the assembly and post test process, well designed for both die and package inspections.